Invention Grant
US09564789B2 Assembly having a substrate, an SMD component, and a lead frame part
有权
具有基板,SMD部件和引线框架部件的组件
- Patent Title: Assembly having a substrate, an SMD component, and a lead frame part
- Patent Title (中): 具有基板,SMD部件和引线框架部件的组件
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Application No.: US14004086Application Date: 2012-03-07
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Publication No.: US09564789B2Publication Date: 2017-02-07
- Inventor: Werner Wallrafen
- Applicant: Werner Wallrafen
- Applicant Address: DE Hannover
- Assignee: Continental Automotive GmbH
- Current Assignee: Continental Automotive GmbH
- Current Assignee Address: DE Hannover
- Agency: Cozen O'Connor
- Priority: DE102011013449 20110309
- International Application: PCT/EP2012/053887 WO 20120307
- International Announcement: WO2012/120032 WO 20120913
- Main IPC: H02K11/00
- IPC: H02K11/00 ; H02K5/22 ; H05K1/18 ; H05K3/32 ; H01G2/06 ; H01G4/248

Abstract:
An assembly, having a substrate made of an electrically insulating material, an SMD component, which has lateral contact surfaces, and a lead frame part made of metal, which is fastened to the substrate and is used to establish electrical connections between the lateral contact surfaces of the SMD component and further functional elements of the assembly, wherein the lead frame part has contact tongues, which resiliently lie against the lateral contact surfaces and are connected to the lateral contact surfaces in a bonded manner.
Public/Granted literature
- US20140001897A1 ASSEMBLY HAVING A SUBSTRATE, AN SMD COMPONENT, AND A LEAD FRAME PART Public/Granted day:2014-01-02
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