Invention Grant
US09564789B2 Assembly having a substrate, an SMD component, and a lead frame part 有权
具有基板,SMD部件和引线框架部件的组件

Assembly having a substrate, an SMD component, and a lead frame part
Abstract:
An assembly, having a substrate made of an electrically insulating material, an SMD component, which has lateral contact surfaces, and a lead frame part made of metal, which is fastened to the substrate and is used to establish electrical connections between the lateral contact surfaces of the SMD component and further functional elements of the assembly, wherein the lead frame part has contact tongues, which resiliently lie against the lateral contact surfaces and are connected to the lateral contact surfaces in a bonded manner.
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