Invention Grant
- Patent Title: Structural body and wiring board
- Patent Title (中): 结构体和接线板
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Application No.: US14412311Application Date: 2013-03-28
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Publication No.: US09564870B2Publication Date: 2017-02-07
- Inventor: Yoshiaki Kasahara , Hiroshi Toyao
- Applicant: NEC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-148869 20120702
- International Application: PCT/JP2013/002111 WO 20130328
- International Announcement: WO2014/006796 WO 20140109
- Main IPC: H01P1/203
- IPC: H01P1/203 ; H01P3/08 ; H03H7/01 ; H01P1/20 ; H01Q15/00 ; H05K1/02 ; H05K1/16
Abstract:
A second conductor plane (102) is formed in a layer different from a layer in which a first conductor plane (101) is formed, and faces the first conductor plane (101). A first transmission line (104) is formed in a layer different from the layers in which the first conductor plane (101) and the second conductor plane (102) are formed, and faces the second conductor plane (102), and one end thereof is an open end. A conductor via (106) connects the other end of the first transmission line (104) and the first conductor plane (101). An insular conductor (112) is connected to a portion of the first transmission line (104) other than a portion thereof at which the transmission line (104) is attached to the conductor via (106), is located in a layer different from the layer in which the second conductor plane (102) is located, and faces the second conductor plane (102).
Public/Granted literature
- US20150155845A1 STRUCTURAL BODY AND WIRING BOARD Public/Granted day:2015-06-04
Information query
