Invention Grant
- Patent Title: Elastic wave device
- Patent Title (中): 弹性波装置
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Application No.: US14170883Application Date: 2014-02-03
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Publication No.: US09564873B2Publication Date: 2017-02-07
- Inventor: Michio Kadota
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-173120 20110808
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/25

Abstract:
An elastic wave device making use of an SH plate wave propagating in LiNbO3 substrates includes a LiNbO3 substrate, IDT electrodes located on at least one surface of the LiNbO3 substrate, and a support which is bonded to the LiNbO3 substrate such that the support is located outside a region provided with the IDT electrodes and supports the LiNbO3 substrate, wherein θ of the Euler angles (0°, θ, 0°) of the LiNbO3 substrate ranges from about 92° to about 138° and the thickness of the LiNbO3 substrate ranges from about 0.05λ to about 0.25λ, where λ is the wavelength determined by the pitch between electrode fingers of the IDT electrodes.
Public/Granted literature
- US20140145556A1 ELASTIC WAVE DEVICE Public/Granted day:2014-05-29
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