There is provided a wiring board including a stiffener bonded to a circuit board, and a laminate formed by laminating a plurality of insulating layers and a plurality of wiring layers on a face of the stiffener opposite to a face bonded to the circuit board. On both faces of the laminate in a laminating direction, terminal connection parts connected to the wiring layers and connected to a terminal part of an electronic component are formed. Further, a component disposition hole, in which the terminal connection parts formed on one of the faces of the laminate are positioned and the electronic component is disposed, and a through hole for connection to the circuit board are formed in the stiffener.