In one embodiment, a method for forming an embedded trace substrate includes forming a conductive layer on a carrier. A dielectric film is provided on the conductive layer. Vias are formed in the dielectric film and extend to portions of the conductive layer. A conductive pattern is formed on the dielectric layer and is electrically connected to the conductive layer through the vias. The carrier is removed and portions of the conductive layer are selectively removed to provide a plurality of bumps pads configured to protrude outwardly from the dielectric layer.