Invention Grant
- Patent Title: Mold-clamping mechanism
- Patent Title (中): 模夹机构
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Application No.: US14816969Application Date: 2015-08-03
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Publication No.: US09566732B2Publication Date: 2017-02-14
- Inventor: Kimiaki Shioiri , Atsushi Murata , Tatsuhiko Nishizawa , Isamu Yamaguchi
- Applicant: NISSEI PLASTIC INDUSTRIAL CO., LTD.
- Applicant Address: JP
- Assignee: NISSEI PLASTIC INDUSTRIAL CO., LTD.
- Current Assignee: NISSEI PLASTIC INDUSTRIAL CO., LTD.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2014-158957 20140804; JP2015-134442 20150703
- Main IPC: B29C45/17
- IPC: B29C45/17

Abstract:
A mold-clamping mechanism in which top and bottom tie bars extend between a pressure-receiving platen and a fixed platen fixed to a bed, a movable platen is movably attached to the tie bars, a toggle link extends between the movable platen and the pressure-receiving platen, the movable platen is moved toward the fixed platen by the toggle link, and a mold is clamped by the movable platen and the fixed platen. The pressure-receiving platen includes a bottom part surrounding a central cavity, and a ceiling part for joining respective top ends of left and right wall parts provided upright from both ends of the bottom part. An opening via which the cavity communicates with the outside is provided to the bottom part and the ceiling part.
Public/Granted literature
- US20160031139A1 MOLD-CLAMPING MECHANISM Public/Granted day:2016-02-04
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