There is provided a method for manufacturing semiconductor chips in which the chips as many as possible are arranged on one substrate and these chips can be cut with high accuracy in a relatively simple process. For such occasion on a wafer, short sides of the semiconductor chips are laid out to be inclined at an angle of 5° or less to a crystal orientation of the wafer. Thereafter, a laser stealth dicing method is used to form a plurality of first dicing lines along long sides of the individual semiconductor chips and a plurality of second dicing lines along short sides thereof.