Invention Grant
- Patent Title: Thermal spray coating, member for semiconductor manufacturing equipment, feedstock material for thermal spray, and method for producing thermal spray coating
- Patent Title (中): 热喷涂，半导体制造设备的构件，用于热喷涂的原料，以及用于制备热喷涂的方法
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Application No.: US14557801Application Date: 2014-12-02
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Publication No.: US09567467B2Publication Date: 2017-02-14
- Inventor: Yosuke Sato , Katsuhiro Inoue , Yuji Katsuda
- Applicant: NGK Insulators, Ltd.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2013-252766 20131206; JP2014-109328 20140527
- Main IPC: C08K3/22
- IPC: C08K3/22 ; C08K3/28 ; C09D1/00 ; C04B35/053 ; C04B35/622 ; C04B35/645 ; C23C4/10
Abstract:
A thermal spray coating according to the present invention contains mainly magnesium, aluminum, oxygen, and nitrogen and has, as a main phase, a crystal phase of a MgO—AlN solid solution in which aluminum nitride is dissolved with magnesium oxide. The thermal spray coating is obtained by thermal spray of powder of a ceramic material containing mainly magnesium, aluminum, oxygen, and nitrogen and having, as a main phase, a crystal phase of a MgO—AlN solid solution in which aluminum nitride is dissolved with magnesium oxide.
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