Invention Grant
- Patent Title: Silicone pressure-sensitive adhesive composition having improved substrate adhesion and pressure-sensitive adhesive article
- Patent Title (中): 具有改进的基材粘合性和压敏粘合剂制品的硅氧烷粘合剂组合物
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Application No.: US14619358Application Date: 2015-02-11
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Publication No.: US09567501B2Publication Date: 2017-02-14
- Inventor: Osamu Tsuchida
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2014-036872 20140227; JP2014-125456 20140618
- Main IPC: C08G77/08
- IPC: C08G77/08 ; C09J183/04 ; C09J183/14 ; C08L83/04 ; C08G77/12 ; C08G77/20 ; C08G77/48
Abstract:
A silicone pressure-sensitive adhesive composition is provided comprising (A) an organopolysiloxane having at least two alkenyl-containing organic groups, (B) a polyorganosiloxane comprising R23SiO1/2 and SiO4/2 units in a molar ratio of 0.5 to 1.0, (C) a polyorganohydrogensiloxane containing at least three Si—H groups, (D) a platinum group metal base catalyst, and (E) an adhesion promoting compound containing at least one recurring unit of formula (3) and at least one Si—H group.
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