Invention Grant
US09568499B2 High performance LIGA spring interconnect system for probing application
有权
用于探测应用的高性能LIGA弹簧互连系统
- Patent Title: High performance LIGA spring interconnect system for probing application
- Patent Title (中): 用于探测应用的高性能LIGA弹簧互连系统
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Application No.: US14088210Application Date: 2013-11-22
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Publication No.: US09568499B2Publication Date: 2017-02-14
- Inventor: James H. McGrath, Jr. , Ira Pollock , David W. Simmen
- Applicant: Tektronix, Inc.
- Applicant Address: US OR Beaverton
- Assignee: TEKTRONIX, INC.
- Current Assignee: TEKTRONIX, INC.
- Current Assignee Address: US OR Beaverton
- Agent Michael A. Nelson; Marger Johnson
- Main IPC: H01R12/88
- IPC: H01R12/88 ; G01R1/067 ; H01R12/81 ; H01R12/82
Abstract:
A zero insertion force (ZIF) connector can include a connector housing defining an opening and an interior space for receiving a mating member, multiple LIGA springs positioned within the interior space and configured to apply pressure to the mating member while in a first position, and a locking component to cause the LIGA springs to move to a second position responsive to a user pressing the locking component. The LIGA springs do not apply pressure to the mating member while in the second position.
Public/Granted literature
- US20150145545A1 HIGH PERFORMANCE LIGA SPRING INTERCONNECT SYSTEM FOR PROBING APPLICATION Public/Granted day:2015-05-28
Information query
IPC分类:
