Invention Grant
- Patent Title: Lens array optical coupling to photonic chip
- Patent Title (中): 透镜阵列光耦合到光子芯片
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Application No.: US14936366Application Date: 2015-11-09
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Publication No.: US09568679B2Publication Date: 2017-02-14
- Inventor: Fuad E Doany , Benjamin G. Lee , Clint L. Schow
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Daniel P. Morris
- Main IPC: G02B6/32
- IPC: G02B6/32 ; G02B6/42 ; H01L21/302 ; G02B6/30

Abstract:
A photonic integrated circuit apparatus is disclosed. The apparatus includes a photonic chip and a lens array coupling element. The photonic chip includes a waveguide at a side edge surface of the photonic chip. The lens array coupling element is mounted on a top surface of the photonic chip and on the side edge surface. The coupling element includes a lens array that is configured to modify spot sizes of light traversing to or from the waveguide. The coupling element further includes an overhang on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip. The overhang includes a vertical stop surface that has a depth configured to horizontally align an edge of the waveguide with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide.
Public/Granted literature
- US20170003453A1 LENS ARRAY OPTICAL COUPLING TO PHOTONIC CHIP Public/Granted day:2017-01-05
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