Invention Grant
- Patent Title: Photosensitive resin composition and uses thereof
- Patent Title (中): 感光树脂组合物及其用途
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Application No.: US14445764Application Date: 2014-07-29
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Publication No.: US09568763B2Publication Date: 2017-02-14
- Inventor: Duan-Chih Wang , Jung-Pin Hsu
- Applicant: CHI MEI CORPORATION
- Applicant Address: TW Tainan
- Assignee: CHI MEI CORPORATION
- Current Assignee: CHI MEI CORPORATION
- Current Assignee Address: TW Tainan
- Agency: WPAT, P.C. Intellectual Property Attorneys
- Agent Anthony King
- Priority: TW102128564A 20130809
- Main IPC: G02B5/23
- IPC: G02B5/23 ; G02F1/1335 ; G02B5/20 ; G03F1/00 ; C09B67/50 ; G02B1/04
Abstract:
The invention relates to a photosensitive resin composition that has the advantages of high developability, good hardness, and good sputtered resistance. The invention also provides a method for manufacturing a color filter, color filter and a liquid crystal display device. The photosensitive resin composition comprises an alkali-soluble resin (A), a compound containing an ethylenically unsaturated group (B), a photoinitiator (C), an organic solvent (D), a pigment (E), and a compound (F).
Public/Granted literature
- US20150041735A1 PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF Public/Granted day:2015-02-12
Information query
