Provided is a mobile terminal capable of allowing a heat generating component such as a CPU to make best use of its capabilities. The sheet-shaped heat pipe, according to the present invention, is provided either between the rear surface of the touch panel and motherboard, or between the one and the battery pack. In this case, since the sheet-shaped heat pipe is arranged opposite to the rear surface of the touch panel which is a part of the chassis of the mobile terminal, a favorable heat diffusion from the heat generating components such as the CPU to a large area on the chassis can be achieved through these sheet-shaped heat pipe, thus allowing the heat generating component such as the CPU to make best use of its capabilities.