Invention Grant
- Patent Title: Modular grinding apparatuses and methods for wafer thinning
- Patent Title (中): 用于晶片薄化的模块化研磨装置和方法
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Application No.: US13370946Application Date: 2012-02-10
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Publication No.: US09570311B2Publication Date: 2017-02-14
- Inventor: Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
- Applicant: Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L21/304
- IPC: H01L21/304 ; B24B37/04 ; B24B37/00
Abstract:
Methods of thinning a plurality of semiconductor wafers and apparatuses for carrying out the same are disclosed. A grinding module within a set of grinding modules receives and grinds a semiconductor wafer. A polishing module receives the semiconductor wafer from the grinding module and polishes the wafer. The polishing module is configured to polish the semiconductor wafer in less time than the grinding module is configured to grind the corresponding wafer.
Public/Granted literature
- US20130210321A1 MODULAR GRINDING APPARATUSES AND METHODS FOR WAFER THINNING Public/Granted day:2013-08-15
Information query
IPC分类:
