Invention Grant
- Patent Title: Method of interfacial oxide layer formation in semiconductor device
- Patent Title (中): 半导体器件界面氧化层形成方法
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Application No.: US14662142Application Date: 2015-03-18
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Publication No.: US09570315B2Publication Date: 2017-02-14
- Inventor: Chueh-Yang Liu , Yi-Liang Ye , Ted Ming-Lang Guo , Yu-Ren Wang
- Applicant: UNITED MICROELECTRONICS CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORPORATION
- Current Assignee: UNITED MICROELECTRONICS CORPORATION
- Current Assignee Address: TW Hsinchu
- Agent Ding Yu Tan
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/02

Abstract:
A method of an interfacial oxide layer formation comprises a plurality of steps. The step (S1) is to remove a native oxide layer from a surface of a substrate; the step (S2) is to form an oxide layer on a surface of a substrate by piranha solution (SPM); the step (S3) is to cleaning a surface of the oxide layer by standard clean 1 (SC1), and the step (S4) is to etch he oxide layer by a solution comprising diluted hydrogen fluoride (dHF) and ozonized pure water (DIO3).
Public/Granted literature
- US20160276165A1 METHOD OF INTERFACIAL OXIDE LAYER FORMATION IN SEMICONDUCTOR DEVICE Public/Granted day:2016-09-22
Information query
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