Invention Grant
- Patent Title: Semiconductor device leadframe
- Patent Title (中): 半导体器件引线框架
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Application No.: US14476812Application Date: 2014-09-04
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Publication No.: US09570323B2Publication Date: 2017-02-14
- Inventor: Freek Egbert van Straten , Jeremy Joy Montalbo Incomio , Albertus Reijs
- Applicant: Ampleon Netherlands B.V.
- Applicant Address: NL Nijmegen
- Assignee: Ampleon Netherlands B.V.
- Current Assignee: Ampleon Netherlands B.V.
- Current Assignee Address: NL Nijmegen
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Priority: EP13186182 20130926
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L23/433 ; H01L23/495 ; H01L23/498
Abstract:
For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.
Public/Granted literature
- US20150084174A1 SEMICONDUCTOR DEVICE LEADFRAME Public/Granted day:2015-03-26
Information query
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