Invention Grant
- Patent Title: Semiconductor device including dummy pattern
- Patent Title (中): 半导体器件包括虚拟图案
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Application No.: US14283050Application Date: 2014-05-20
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Publication No.: US09570378B2Publication Date: 2017-02-14
- Inventor: Yorio Takada
- Applicant: PS4 LUXCO S.A.R.L.
- Applicant Address: LU Luxembourg
- Assignee: LONGITUDE SEMICONDUCTOR S.A.R.L.
- Current Assignee: LONGITUDE SEMICONDUCTOR S.A.R.L.
- Current Assignee Address: LU Luxembourg
- Agency: Kunzler Law Group, PC
- Priority: JP2007-162437 20070620
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L23/49 ; H01L21/321 ; H01L21/768 ; H01L23/522 ; H01L27/02 ; H01L23/00

Abstract:
A semiconductor device includes a substrate including a circuit region, a dummy region, and a dummy clearance section surrounding the circuit region, and a plurality of dummy patterns formed in the dummy region, the plurality of dummy patterns comprising a first dummy pattern and a second dummy pattern, a distance between the first dummy pattern and the circuit region being less than a distance between the second dummy pattern and the circuit region, and a dummy pattern being absent between the first dummy pattern and the circuit region. The first dummy pattern includes an area which is greater than an area of the second dummy pattern.
Public/Granted literature
- US20140246780A1 SEMICONDUCTOR DEVICE INCLUDING DUMMY PATTERN Public/Granted day:2014-09-04
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