Invention Grant
- Patent Title: FinFET power supply decoupling
- Patent Title (中): FinFET电源去耦
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Application No.: US14752399Application Date: 2015-06-26
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Publication No.: US09570388B2Publication Date: 2017-02-14
- Inventor: Todd A. Christensen , John E. Sheets, II
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/50 ; H01L27/088 ; H03K17/04

Abstract:
Embodiments herein describe dummy gates disposed over a portion of a fin in finFETs. That is, instead of separating the dummy gates from the finFET structure, the fins may be extended and covered, at least partially, by the dummy gates. An insulative material is disposed between the dummy gate and the fin in order to form a decoupling capacitor. In one embodiment, the dummy gate overlaps a portion of the fin that is held at a voltage rail. Moreover, the dummy gate may be coupled to a different (e.g., opposite) voltage rail than rail coupled to the fin. For example, if the fin is coupled to VHIGH then the dummy gate is coupled to VLOW, or vice versa. Thus, the capacitor formed using the fin and the dummy gate provides a decoupling capacitance between the power sources generating the voltage rails (i.e., VHIGH and VLOW).
Public/Granted literature
- US20160379928A1 FINFET POWER SUPPLY DECOUPLING Public/Granted day:2016-12-29
Information query
IPC分类: