Invention Grant
US09570488B2 Image sensor bending by induced substrate swelling 有权
图像传感器弯曲受到诱发底物肿胀

Image sensor bending by induced substrate swelling
Abstract:
In some examples, techniques and architectures for fabricating an image sensor chip having a curved surface include placing a substrate on a first surface of an image sensor chip, wherein the first surface of the image sensor chip is opposite a second surface of the image sensor chip, and wherein the second surface of the image sensor chip includes light sensors to generate electrical signals in response to receiving light. Fabricating also includes modifying a volume of the substrate so as to impart forces on the image sensor chip to produce a curved image sensor chip.
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