Invention Grant
- Patent Title: Image sensor bending by induced substrate swelling
- Patent Title (中): 图像传感器弯曲受到诱发底物肿胀
-
Application No.: US14491903Application Date: 2014-09-19
-
Publication No.: US09570488B2Publication Date: 2017-02-14
- Inventor: Geoffrey P. McKnight , John J. Vajo , Jason A. Graetz
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Agent Stephen A. Wight; Sandy Swain; Micky Minhas
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L33/00 ; H01L29/84 ; H01L31/00 ; H01L27/146

Abstract:
In some examples, techniques and architectures for fabricating an image sensor chip having a curved surface include placing a substrate on a first surface of an image sensor chip, wherein the first surface of the image sensor chip is opposite a second surface of the image sensor chip, and wherein the second surface of the image sensor chip includes light sensors to generate electrical signals in response to receiving light. Fabricating also includes modifying a volume of the substrate so as to impart forces on the image sensor chip to produce a curved image sensor chip.
Public/Granted literature
- US20160086987A1 Image Sensor Bending By Induced Substrate Swelling Public/Granted day:2016-03-24
Information query
IPC分类: