Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US15016322Application Date: 2016-02-05
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Publication No.: US09570625B2Publication Date: 2017-02-14
- Inventor: Shunpei Yamazaki
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., LTD.
- Current Assignee: Semiconductor Energy Laboratory Co., LTD.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2012-264583 20121203
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/423 ; H01L29/417 ; H01L29/24

Abstract:
To provide a semiconductor device which can be miniaturized or highly integrated. To obtain a semiconductor device including an oxide semiconductor, which has favorable electrical characteristics. To provide a highly reliable semiconductor device including an oxide semiconductor, by suppression of a change in its electrical characteristics. The semiconductor device includes an island-like oxide semiconductor layer over an insulating surface; an insulating layer surrounding a side surface of the oxide semiconductor layer; a source electrode layer and a drain electrode layer in contact with top surfaces of the oxide semiconductor layer and the insulating layer; a gate electrode layer overlapping with the oxide semiconductor layer; and a gate insulating layer between the oxide semiconductor layer and the gate electrode layer. The source electrode layer and the drain electrode layer are provided above the top surface of the oxide semiconductor layer. The top surface of the insulating layer is planarized.
Public/Granted literature
- US20160163872A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-06-09
Information query
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