Invention Grant
- Patent Title: Method of encapsulating an optoelectronic device and light-emitting diode chip
- Patent Title (中): 封装光电器件和发光二极管芯片的方法
-
Application No.: US14413029Application Date: 2012-07-10
-
Publication No.: US09570662B2Publication Date: 2017-02-14
- Inventor: Sebastian Taeger , Michael Huber , Martin Welzel , Karl Engl
- Applicant: Sebastian Taeger , Michael Huber , Martin Welzel , Karl Engl
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- International Application: PCT/EP2012/063484 WO 20120710
- International Announcement: WO2014/008927 WO 20140116
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/54 ; H01L33/44 ; H01L33/56
Abstract:
A method of encapsulating an optoelectronic device includes providing a surface intended to be encapsulated, the surface containing platinum, generating reactive oxygen groups and/or reactive hydroxyl groups on the surface, and depositing a passivation layer by atomic layer deposition on the surface.
Public/Granted literature
- US20160027972A1 METHOD OF ENCAPSULATING AN OPTOELECTRONIC DEVICE AND LIGHT-EMITTING DIODE CHIP Public/Granted day:2016-01-28
Information query
IPC分类:
