Invention Grant
- Patent Title: Wire protection structure
- Patent Title (中): 电线保护结构
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Application No.: US14464962Application Date: 2014-08-21
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Publication No.: US09570898B2Publication Date: 2017-02-14
- Inventor: Hiroyuki Suzuki
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: JP2012-063041 20120321
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H02G15/007 ; H01R13/52 ; H01R13/56 ; H02G15/10

Abstract:
A wire protection structure includes a housing, a holder that is received in the housing through an opening of the housing, a cover that covers at least a part of the opening of the housing to define a wire-drawn port with the holder being received in the housing, and an electric wire that is drawn from the wire-drawn port. A flexible plate-shaped holder plate is provided to be extended from a surface of the holder toward the wire-drawn port. A deflection allowable space is formed between the holder plate and the housing to allow a deflection of the holder plate.
Public/Granted literature
- US20140360774A1 Wire Protection Structure Public/Granted day:2014-12-11
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