Invention Grant
- Patent Title: Support plate for solid-state imaging element, method for manufacturing the same, and solid-state imaging device
- Patent Title (中): 用于固态成像元件的支撑板,其制造方法和固态成像装置
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Application No.: US14728303Application Date: 2015-06-02
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Publication No.: US09571706B2Publication Date: 2017-02-14
- Inventor: Satoru Murayama , Reiji Higuchi
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-264799 20121203
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L23/06 ; G02B7/02 ; G02B5/00 ; G02B5/26 ; H04N5/357 ; H01L27/146 ; G02B5/20 ; H04N5/374 ; G03F7/00 ; G03F7/032 ; G03F7/105

Abstract:
A solid-state imaging device comprises an image sensor, a circuit board, a support plate, an IR cut filter, a taking lens, a lens holder, and a support barrel. The image sensor is mounted on the circuit board. The circuit board is fixed to the support plate with the image sensor placed inside an opening of a plate body of the support plate. The sides of the image sensor are surrounded by the support plate. The IR cut filter is fixed to the support plate so as to cover the opening. The image sensor is disposed on an exit surface side of the taking lens. The IR cut filter is disposed between the taking lens and the image sensor. A light-shielding layer is formed over entire periphery of an inner wall of the plate body. Harmful rays are blocked by the light-shielding layer.
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