Invention Grant
US09572257B2 Multi-layered printed circuit board having core layers including indicia
有权
具有包括标记的核心层的多层印刷电路板
- Patent Title: Multi-layered printed circuit board having core layers including indicia
- Patent Title (中): 具有包括标记的核心层的多层印刷电路板
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Application No.: US14449089Application Date: 2014-07-31
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Publication No.: US09572257B2Publication Date: 2017-02-14
- Inventor: Brian Wade Carlson , William Hollender , Donald Ingram
- Applicant: Keysight Technologies, Inc.
- Applicant Address: US CA Santa Rosa
- Assignee: Keysight Technologies, Inc.
- Current Assignee: Keysight Technologies, Inc.
- Current Assignee Address: US CA Santa Rosa
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11

Abstract:
A printed circuit board (PCB) includes a stack of core layers disposed one over another, and electrically conductive interconnects extending vertically in the stack. Each of the core layers includes a substrate having opposite major surfaces, an electrically conductive active trace extending along at least one of the major surfaces, and an indicium. The stack also has an exposed edge where the indicia of the layers are together revealed. The indicia provide identifying and/or fiducial information about the PCB.
Public/Granted literature
- US20160037637A1 MULTI-LAYERED PRINTED CIRCUIT BOARD HAVING CORE LAYERS INCLUDING INDICIA Public/Granted day:2016-02-04
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