Invention Grant
- Patent Title: Heat-dissipation structure for an indicia reading module
- Patent Title (中): 标记读取模块的散热结构
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Application No.: US15079882Application Date: 2016-03-24
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Publication No.: US09572284B2Publication Date: 2017-02-14
- Inventor: Chen Feng , Tao Xian , Edward C. Bremer
- Applicant: Hand Held Products, Inc.
- Applicant Address: US SC Fort Mill
- Assignee: Hand Held Products, Inc.
- Current Assignee: Hand Held Products, Inc.
- Current Assignee Address: US SC Fort Mill
- Agency: Additon, Higgins & Pendleton, P.A.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06K7/10 ; G06F1/16 ; G06F1/20
Abstract:
Small mobile computing devices place stringent requirements on the electronic modules integrated within. High temperatures inside these mobile computing devices are unavoidable; therefore good thermal management is important to insure proper module operation. Here a heat-dissipation structure for an indicia-reading module integrated within a mobile computing device is disclosed.
Public/Granted literature
- US20160203350A1 HEAT-DISSIPATION STRUCTUREFOR AN INDICIA READING MODULE Public/Granted day:2016-07-14
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