Invention Grant
- Patent Title: Polymer thick film positive temperature coefficient carbon composition
- Patent Title (中): 聚合物厚膜正温度系数碳组成
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Application No.: US13859843Application Date: 2013-04-10
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Publication No.: US09573438B2Publication Date: 2017-02-21
- Inventor: Jay Robert Dorfman , Vince Arancio
- Applicant: E I DU PONT DE NEMOURS AND COMPANY
- Applicant Address: US DE Wilmington
- Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee Address: US DE Wilmington
- Main IPC: B60H1/00
- IPC: B60H1/00 ; B05D5/12 ; H01C7/00 ; B60N2/56 ; B60R1/06 ; H01B1/24 ; H05B3/84 ; H05B3/14 ; C08K3/04

Abstract:
The invention is directed to a polymer thick film positive temperature coefficient carbon resistor composition consisting essentially of: (a) organic medium consisting of: (i) a fluoropolymer resin consisting of a copolymer of vinylidene difluoride and hexafluoropropylene; and (ii) an organic solvent consisting of triethyl phosphate; and (b) conductive carbon powder. The composition may be processed at a time and temperature necessary to remove all solvent. The invention is further directed to positive temperature coefficient (PTC) circuits comprising the composition of the invention which has been dried to remove the solvent and to articles, e.g., mirror heaters and seat heaters, containing such PTC circuits as well as a method for making such PTC circuits.
Public/Granted literature
- US20140305923A1 POLYMER THICK FILM POSITIVE TEMPERATURE COEFFICIENT CARBON COMPOSITION Public/Granted day:2014-10-16
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