Invention Grant
- Patent Title: Inter-machine buffer for mailpiece fabrication system
- Patent Title (中): 邮件制作系统的机间缓冲器
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Application No.: US14113973Application Date: 2012-06-01
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Publication No.: US09573709B2Publication Date: 2017-02-21
- Inventor: Carl L. Chapman , Arthur H. DePoi , Boris Rosenfeld , John R. Masotta , Aris Ballestrazzi
- Applicant: Carl L. Chapman , Arthur H. DePoi , Boris Rosenfeld , John R. Masotta , Aris Ballestrazzi
- Applicant Address: US CT Stamford
- Assignee: Pitney Bowes Inc.
- Current Assignee: Pitney Bowes Inc.
- Current Assignee Address: US CT Stamford
- Agent Steven J. Shapiro; Charles R. Malandra, Jr.
- International Application: PCT/US2012/040422 WO 20120601
- International Announcement: WO2012/167050 WO 20121206
- Main IPC: B65B11/48
- IPC: B65B11/48 ; B65B11/00 ; B65B57/02 ; B43M5/04 ; B65B9/06

Abstract:
A system and method for wrapping sheet material to produce finished mailpieces includes an upstream content module, a downstream mailpiece assembly module including a wrapper module adapted to encapsulate content material, and a buffer module interposing the upstream content and downstream assembly modules. The buffer module includes a plurality of buffer gates adapted to convey the content material from an upstream gate to a downstream gate to maintain a threshold pitch distance between successive pieces of content material. A controller is operatively coupled to the modules and controls the conveyance of content material through the buffer gates. More specifically, the controller coordinates the delivery and insertion of content material into the wrapper module to minimize dry-holes, maintain stresses below a threshold level to ensure continued operation, and optimize system throughput.
Public/Granted literature
- US20140150378A1 INTER-MACHINE BUFFER FOR MAILPIECE FABRICATION SYSTEM Public/Granted day:2014-06-05
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