Invention Grant
- Patent Title: Splicing device and splicing method
- Patent Title (中): 拼接装置和拼接方法
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Application No.: US14389145Application Date: 2012-04-18
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Publication No.: US09573783B2Publication Date: 2017-02-21
- Inventor: Xiao Dong Chi
- Applicant: Xiao Dong Chi
- Applicant Address: JP Chiryu-shi
- Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee Address: JP Chiryu-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2012/060513 WO 20120418
- International Announcement: WO2013/157107 WO 20131024
- Main IPC: B65H20/20
- IPC: B65H20/20 ; B65H19/18 ; H05K13/02

Abstract:
A splicing device and splicing method in which automatic and accurate splicing is performed by inserting two carrier tapes into the device. The splicing device including cutting devices for cutting the tail end of number one carrier tape and the leading end of number two carrier tape at a predetermined cutting position; a positioning device for indexing number one and number two carrier tapes towards each other respectively to splicing position at which positioning pins engage with indexing holes of the number one and number two carrier tapes; and a joining device which, with splicing tape affixed to connected protective tape positioned at the splicing position, folds protective tape and joins the splicing tape to both surfaces of number one and number two carrier tapes straddling thereof.
Public/Granted literature
- US20150060590A1 SPLICING DEVICE AND SPLICING METHOD Public/Granted day:2015-03-05
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