Invention Grant
US09573800B2 Pre-molded MEMS device package having conductive column coupled to leadframe and cover
有权
具有耦合到引线框和盖的导电柱的预成型的MEMS器件封装
- Patent Title: Pre-molded MEMS device package having conductive column coupled to leadframe and cover
- Patent Title (中): 具有耦合到引线框和盖的导电柱的预成型的MEMS器件封装
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Application No.: US14918521Application Date: 2015-10-20
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Publication No.: US09573800B2Publication Date: 2017-02-21
- Inventor: Thomas M. Goida
- Applicant: Invensense, Inc.
- Applicant Address: US CA San Jose
- Assignee: INVENSENSE, INC.
- Current Assignee: INVENSENSE, INC.
- Current Assignee Address: US CA San Jose
- Agency: IPxLaw Group LLP
- Agent Maryam Imam
- Main IPC: B81B7/00
- IPC: B81B7/00 ; H01L23/495 ; H01L21/50
Abstract:
A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body. In some embodiments, a conductive column extends through the pre-molded body to allow electrical connection from a partially encapsulated lead frame to the conductive cover. Some embodiments may include a multi-tiered cavity within the mold body for mounting an integrated circuit separated by a gap above the MEMS device.
Public/Granted literature
- US20160130134A1 PRE-MOLDED MEMS DEVICE PACKAGE HAVING CONDUCTIVE COLUMN COUPLED TO LEADFRAME AND COVER Public/Granted day:2016-05-12
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