Invention Grant
US09573802B2 Method and apparatus for building three-dimensional MEMS elements
有权
用于构建三维MEMS元件的方法和装置
- Patent Title: Method and apparatus for building three-dimensional MEMS elements
- Patent Title (中): 用于构建三维MEMS元件的方法和装置
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Application No.: US13397174Application Date: 2012-02-15
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Publication No.: US09573802B2Publication Date: 2017-02-21
- Inventor: Brian Lee Wardle , Fabio Ferruccio Fachin , Stefan Nikles , Mathew Varghese
- Applicant: Brian Lee Wardle , Fabio Ferruccio Fachin , Stefan Nikles , Mathew Varghese
- Applicant Address: US MA Cambridge
- Assignee: Massachusetts Institute of Technology
- Current Assignee: Massachusetts Institute of Technology
- Current Assignee Address: US MA Cambridge
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B81C1/00

Abstract:
The disclosure generally relates to method and apparatus for forming three-dimensional MEMS. More specifically, the disclosure relates to a method of controlling out-of-plane buckling in microstructural devices so as to create micro-structures with out-of-plane dimensions which are 1×, 5×, 10×, 100× or 500× the film's thickness or above the surface of the wafer. An exemplary device formed according to the disclosed principles, includes a three dimensional accelerometer having microbridges extending both above and below the wafer surface.
Public/Granted literature
- US20130207511A1 METHOD AND APPARATUS FOR BUILDING THREE-DIMENSIONAL MEMS ELEMENTS Public/Granted day:2013-08-15
Information query
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