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US09573802B2 Method and apparatus for building three-dimensional MEMS elements 有权
用于构建三维MEMS元件的方法和装置

Method and apparatus for building three-dimensional MEMS elements
Abstract:
The disclosure generally relates to method and apparatus for forming three-dimensional MEMS. More specifically, the disclosure relates to a method of controlling out-of-plane buckling in microstructural devices so as to create micro-structures with out-of-plane dimensions which are 1×, 5×, 10×, 100× or 500× the film's thickness or above the surface of the wafer. An exemplary device formed according to the disclosed principles, includes a three dimensional accelerometer having microbridges extending both above and below the wafer surface.
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