Invention Grant
- Patent Title: Embossed polymer sheet
- Patent Title (中): 压花聚合物片
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Application No.: US14219489Application Date: 2014-03-19
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Publication No.: US09574028B2Publication Date: 2017-02-21
- Inventor: Vincent J. Yacovone
- Applicant: Solutia Inc.
- Applicant Address: US MO St. Louis
- Assignee: Solutia Inc.
- Current Assignee: Solutia Inc.
- Current Assignee Address: US MO St. Louis
- Agent Michelle Bugbee
- Main IPC: C08F116/06
- IPC: C08F116/06 ; B32B17/10 ; C08J5/18

Abstract:
A high frequency semi-isotropic embossed polymer interlayer sheet is disclosed. The embossed polymer interlayer sheet has a first side; a second side opposing the first side; and an embossed surface on at least one of the sides, and a surface texture ratio, Str, (as measured per ISO 25178) of between 0.1 and 0.99. The embossed polymer sheet may have at least 50 roughness peaks per centimeter (R PC, as measured per ASME B46.1 [1985]). The embossed polymer sheet may have a mottle value of less than or equal to 2.5 (as measured by a Clear Mottle Analyzer [CMA]). The embossed polymer sheet may be polyvinyl butyral.
Public/Granted literature
- US20140302281A1 EMBOSSED POLYMER SHEET Public/Granted day:2014-10-09
Information query
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