Invention Grant
- Patent Title: Processes and compositions for injection blow molding
- Patent Title (中): 注塑吹塑成型的方法和组成
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Application No.: US13056710Application Date: 2009-08-28
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Publication No.: US09574064B2Publication Date: 2017-02-21
- Inventor: Mridula Kapur , Alan T. Radwanski
- Applicant: Mridula Kapur , Alan T. Radwanski
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- International Application: PCT/US2009/055328 WO 20090828
- International Announcement: WO2010/025342 WO 20100304
- Main IPC: B29C49/06
- IPC: B29C49/06 ; C08F10/02 ; C08L23/04 ; C08K5/00 ; B29C49/00 ; C08K5/098 ; C08K5/20 ; B29C37/00 ; B29L31/00

Abstract:
The invention provides a process for injection blow molding an article, said process comprising injecting into a mold cavity a composition, comprising at least one ethylene-based polymer and less than, or equal to, 1000 ppm of a mold release agent, based on the total weight of the composition. The invention also provides a composition comprising a blend, wherein the blend comprises at least one high molecular weight (HMW) ethylene-based polymer, and at least one low molecular weight (LMW) ethylene-based polymer, and wherein the blend has an unsaturation level, as determined by IR, and expressed as vinyls per 1000 carbon atoms, less than, or equal to, 0.5 vinyls per 1000 carbon atoms, and wherein the high molecular weight (HMW) ethylene-based polymer has a density from 0.925 to 0.950 g/cc.
Public/Granted literature
- US20110136983A1 PROCESSES AND COMPOSTIONS FOR INJECTION BLOW MOLDING Public/Granted day:2011-06-09
Information query