Invention Grant
- Patent Title: Soft thermoplastic resin composition
- Patent Title (中): 软热塑性树脂组合物
-
Application No.: US14910162Application Date: 2014-08-06
-
Publication No.: US09574082B2Publication Date: 2017-02-21
- Inventor: Yoshiaki Matsuoka
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka-shi
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-163574 20130806
- International Application: PCT/JP2014/070773 WO 20140806
- International Announcement: WO2015/020104 WO 20150212
- Main IPC: C08L67/04
- IPC: C08L67/04 ; C08L25/12 ; C08L27/06 ; C08J5/18 ; C08J5/00

Abstract:
A soft thermoplastic resin composition comprising:100 parts by weight of a resin component (A) containing 15 to 65 parts by weight of a vinyl chloride resin having a degree of polymerization of 2000 or less, and 35 to 85 parts by weight of a polyhydroxyalkanoate; and 0.1 to 8 parts by weight of a resin component (B) which is one or more resins selected from the group consisting of a (meth)acrylate resin and an acrylonitrile-styrene resin, and has a weight average molecular weight, in terms of the polystyrene, of 400,000 or more.
Public/Granted literature
- US20160177087A1 SOFT THERMOPLASTIC RESIN COMPOSITION Public/Granted day:2016-06-23
Information query