Invention Grant
- Patent Title: Hole transport composition
- Patent Title (中): 空孔运输组成
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Application No.: US13680164Application Date: 2012-11-19
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Publication No.: US09574084B2Publication Date: 2017-02-21
- Inventor: Reid John Chesterfield
- Applicant: E I DU PONT DE NEMOURS AND COMPANY
- Applicant Address: US DE Wilmington
- Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee Address: US DE Wilmington
- Main IPC: H01B1/00
- IPC: H01B1/00 ; H01L51/00 ; C08L79/02 ; H01B1/12 ; C08G61/12 ; C08G73/02 ; C08L65/00 ; H01L51/50
Abstract:
There is provided a hole transport composition having (i) a first hole transport polymer having crosslinkable groups, and (ii) a second hole transport polymer having substantially no crosslinkable groups. There is also provided a crosslinked hole transport layer and an electronic device containing the crosslinked hole transport layer.
Public/Granted literature
- US20130150536A1 HOLE TRANSPORT COMPOSITION Public/Granted day:2013-06-13
Information query
