Invention Grant
- Patent Title: Resin composition, resin film, and electronic device
- Patent Title (中): 树脂组合物，树脂膜和电子器件
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Application No.: US14913474Application Date: 2014-08-25
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Publication No.: US09574090B2Publication Date: 2017-02-21
- Inventor: Hiroaki Shindo
- Applicant: ZEON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ZEON CORPORATION
- Current Assignee: ZEON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2013-175463 20130827
- International Application: PCT/JP2014/072111 WO 20140825
- International Announcement: WO2015/029931 WO 20150305
- Main IPC: C08F2/46
- IPC: C08F2/46 ; C08F2/50 ; C08G61/04 ; C09D4/06 ; C08F2/44 ; C08F283/14 ; C08F220/06 ; C08F222/20 ; C08F222/40 ; C08F222/10 ; C08F230/08
Abstract:
A resin composition containing a binder resin (A), alkoxysilyl group-containing (meth)acrylate compound (B), tetrafunctional or higher functional (meth)acrylate compound (C), and photopolymerization initiator (D), wherein a total content of the alkoxysilyl group-containing (meth)acrylate compound (B) and the tetrafunctional or higher functional (meth)acrylate compound (C) is 0.5 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A) is provided.
Public/Granted literature
- US20160200914A1 RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE Public/Granted day:2016-07-14
Information query
