A silver-containing alloy electrolytic plating bath that can produce silver-containing alloy plated products having excellent resistance to oxidation suitable for electronic members, decoration members, and dental members, is described, along with a method for electrolytic plating using the same. The silver-containing alloy plated products have excellent resistance to oxidation and can be manufactured by using the plating bath that contains (a) a silver compound containing 99.9% to 46% by mass of silver on the basis of the total metal mass therein, (b) a gadolinium compound containing 0.1% to 54% by mass of gadolinium on the basis of the total metal mass therein, (c) at least one kind of complexing agent, and (d) a solvent.