Invention Grant
- Patent Title: Ink jet etching method and ink jet printing system
- Patent Title (中): 喷墨蚀刻方法和喷墨打印系统
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Application No.: US14658748Application Date: 2015-03-16
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Publication No.: US09574301B2Publication Date: 2017-02-21
- Inventor: Kazuhiko Kitamura
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2014-054539 20140318; JP2014-063237 20140326; JP2014-236554 20141121
- Main IPC: D06Q1/02
- IPC: D06Q1/02 ; B41J2/01 ; B41J2/16 ; D06P5/30

Abstract:
An ink jet etching method according to the invention includes an etching step of etching fabric by using an ink set including first etching ink containing an etching agent, and second etching ink containing the etching agent in which a concentration of the etching agent is lower than a concentration of the etching agent in the first etching ink, in which etching fabric includes ejecting the first etching ink is ejected from two or more nozzle arrays among a plurality of nozzle arrays included in a recording head.
Public/Granted literature
- US20150267346A1 INK JET ETCHING METHOD AND INK JET PRINTING SYSTEM Public/Granted day:2015-09-24
Information query