Invention Grant
- Patent Title: Arrangement and method for reinforcing supporting structures
- Patent Title (中): 加强支撑结构的布置和方法
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Application No.: US14896284Application Date: 2014-06-06
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Publication No.: US09574359B2Publication Date: 2017-02-21
- Inventor: Thierry Berset
- Applicant: SIKA TECHNOLOGY AG
- Applicant Address: CH Baar
- Assignee: SIKA TECHNOLOGY AG
- Current Assignee: SIKA TECHNOLOGY AG
- Current Assignee Address: CH Baar
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: EP13170879 20130606
- International Application: PCT/EP2014/061915 WO 20140606
- International Announcement: WO2014/195504 WO 20141211
- Main IPC: E04G23/02
- IPC: E04G23/02 ; E04C5/07

Abstract:
The present disclosure relates to an arrangement having a supporting structure having a surface containing (e.g., consisting of) one or more faces, wherein a bore runs from at least one face into an inner region of the supporting structure, and this bore is filled with an adhesive and with a portion of a fibre bundle projecting beyond said face, wherein, on the at least one face, from which the bore runs into an inner region of the supporting structure, the supporting structure is provided with at least one groove which, starting from the bore, extends in at least one direction on the surface, and the projecting part of the fibre bundle is located, at least in part, in the at least one groove and is fastened therein by way of the adhesive.
Public/Granted literature
- US20160138285A1 ARRANGEMENT AND METHOD FOR REINFORCING SUPPORTING STRUCTURES Public/Granted day:2016-05-19
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