There is provided a honeycomb structure where a crack at honeycomb segments, which constitute a honeycomb bonded assembly, is reduced. A honeycomb structure has a pillar-shaped honeycomb bonded assembly that has a plurality of pillar-shaped honeycomb segments having a porous partition wall defining a plurality of cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid, and a bonding layer bonding side surfaces of the plurality of honeycomb segments, and in the honeycomb bonded assembly, at 25 to 800° C., a thermal expansion coefficient of the bonding layer is larger than a thermal expansion coefficient of the honeycomb segment.