Invention Grant
- Patent Title: Microchannel coil manifold system
- Patent Title (中): 微通道线圈歧管系统
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Application No.: US12750914Application Date: 2010-03-31
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Publication No.: US09574827B2Publication Date: 2017-02-21
- Inventor: Stephen Troutman
- Applicant: Stephen Troutman
- Applicant Address: US TX Richardson
- Assignee: Heatcraft Refrigeration Products LLC
- Current Assignee: Heatcraft Refrigeration Products LLC
- Current Assignee Address: US TX Richardson
- Agency: Baker Botts L.L.P.
- Main IPC: F28F9/26
- IPC: F28F9/26 ; F28D1/04 ; F25B39/04 ; F28B1/06

Abstract:
The present application provides a microchannel coil manifold system. The microchannel coil manifold system may include a number of assembly inlet manifold sections that terminate in a first stub tube, a number of assembly outlet manifold sections that terminate in a second stub tube, and one or more microchannel coils. Each pair of assembly inlet and outlet manifold sections may be in communication with the one or more microchannel coils.
Public/Granted literature
- US20110139423A1 MICROCHANNEL COIL MANIFOLD SYSTEM Public/Granted day:2011-06-16
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