Invention Grant
US09575117B2 Testing stacked devices 有权
测试堆叠设备

Testing stacked devices
Abstract:
Testing stacked devices. In accordance with a first method embodiment, a primary circuit assembly is accessed from a first circuit assembly carrier. The primary circuit assembly is placed into a test fixture. A secondary circuit assembly is accessed from a second circuit assembly carrier. The secondary circuit assembly is placed into the test fixture on top of the primary circuit assembly. The primary circuit assembly is tested in conjunction with said secondary circuit assembly while coupled together.
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