Invention Grant
- Patent Title: Testing stacked devices
- Patent Title (中): 测试堆叠设备
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Application No.: US13865937Application Date: 2013-04-18
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Publication No.: US09575117B2Publication Date: 2017-02-21
- Inventor: Ling Qi , Tung Sheng Hsieh
- Applicant: Advantest Corporation
- Applicant Address: JP Tokyo
- Assignee: ADVANTEST CORPORATION
- Current Assignee: ADVANTEST CORPORATION
- Current Assignee Address: JP Tokyo
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R31/28

Abstract:
Testing stacked devices. In accordance with a first method embodiment, a primary circuit assembly is accessed from a first circuit assembly carrier. The primary circuit assembly is placed into a test fixture. A secondary circuit assembly is accessed from a second circuit assembly carrier. The secondary circuit assembly is placed into the test fixture on top of the primary circuit assembly. The primary circuit assembly is tested in conjunction with said secondary circuit assembly while coupled together.
Public/Granted literature
- US20140312926A1 TESTING STACKED DEVICES Public/Granted day:2014-10-23
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