Invention Grant
- Patent Title: Semiconductor device comprising an output driver circuitry, a packaged semiconductor device and associated methods
- Patent Title (中): 半导体器件包括输出驱动器电路,封装半导体器件和相关方法
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Application No.: US14379892Application Date: 2012-02-24
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Publication No.: US09575118B2Publication Date: 2017-02-21
- Inventor: Hubert Bode
- Applicant: Hubert Bode
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- International Application: PCT/IB2012/050856 WO 20120224
- International Announcement: WO2013/124711 WO 20130829
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L23/00 ; G05F1/46

Abstract:
A semiconductor device comprises a plurality of output pads bondable to an output pin, a plurality of reference pads bondable to a reference pin, and output driver circuitry with a control terminal for receiving a control signal and arranged to drive the plurality of output pads relative to the plurality of reference pads in dependence on the control signal. The output driver circuitry includes driver sections and selection circuitry. Each driver section is arranged to drive an output pad relative to the single reference pad in dependence on a respective section control signal. The reference pads are connected in a one-to-one relationship to the driver sections. The output pads are connected in a one-to-one relationship to the driver sections. The selection circuitry provides the respective section control signals to the driver sections in dependence on at least one selection signal and the control signal.
Public/Granted literature
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