Invention Grant
- Patent Title: Production method of scintillator array
- Patent Title (中): 闪烁体阵列的制作方法
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Application No.: US14389150Application Date: 2013-03-14
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Publication No.: US09575188B2Publication Date: 2017-02-21
- Inventor: Hideo Nitta
- Applicant: HITACHI METALS, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-079308 20120330
- International Application: PCT/JP2013/057239 WO 20130314
- International Announcement: WO2013/146304 WO 20131003
- Main IPC: G01T1/20
- IPC: G01T1/20 ; B32B37/24 ; B32B38/00 ; B32B38/10

Abstract:
A method for producing a scintillator array comprising fixing a scintillator substrate to a support plate via a double-coated adhesive sheet, at least an adhesive surface thereof to be in contact with the scintillator substrate being thermally peelable; providing the scintillator substrate with lattice-patterned grooves to form pluralities of scintillator cells; filling gaps between the scintillator cells with a liquid hardening reflector resin; curing the liquid hardening reflector resin by heating to form a resin-hardened scintillator cell body; and then peeling the double-coated adhesive sheet from the resin-hardened scintillator cell body by heating.
Public/Granted literature
- US20150059963A1 PRODUCTION METHOD OF SCINTILLATOR ARRAY Public/Granted day:2015-03-05
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