Invention Grant
US09575410B2 Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device
有权
感光树脂组合物，硬化浮雕图案的制造方法，半导体装置和显示装置
- Patent Title: Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device
- Patent Title (中): 感光树脂组合物，硬化浮雕图案的制造方法，半导体装置和显示装置
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Application No.: US14363557Application Date: 2012-12-06
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Publication No.: US09575410B2Publication Date: 2017-02-21
- Inventor: Satoshi Shibui , Tatsuya Hirata , Takahiro Sasaki , Taisuke Yamada
- Applicant: ASAHI KASEI E-MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ASAHI KASEI E-MATERIALS CORPORATION
- Current Assignee: ASAHI KASEI E-MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2011-270661 20111209; JP2011-290126 20111228; JP2012-057990 20120314
- International Application: PCT/JP2012/081691 WO 20121206
- International Announcement: WO2013/085004 WO 20130613
- Main IPC: G03F7/038
- IPC: G03F7/038 ; G03F7/039 ; G03F7/004 ; C08L65/00 ; G03F7/023 ; C08G8/22 ; C08G16/02 ; C08L61/12 ; G03F7/022 ; C08G61/12 ; G03F7/30 ; C08G61/02
Abstract:
Provided is a photosensitive resin composition which comprises: (A-1) a resin containing a structure represented by general formula (1); and (B) a photo-acid generating agent. In general formula (1), X, R1 to R7, m1 to m4, n1, n2, Y and W are each as defined in the description.
Public/Granted literature
Information query
IPC分类:
