Invention Grant
- Patent Title: Electronic device with stackable modules
- Patent Title (中): 具有可堆叠模块的电子设备
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Application No.: US14824610Application Date: 2015-08-12
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Publication No.: US09575509B2Publication Date: 2017-02-21
- Inventor: Chun-Jen Lin
- Applicant: ScienBiZip Consulting (Shen Zhen) Co, Ltd.
- Applicant Address: CN Shenzhen
- Assignee: ScienBiziP Consulting (Shenzhen) Co., Ltd.
- Current Assignee: ScienBiziP Consulting (Shenzhen) Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agent Zhigang Ma
- Priority: CN201510030458 20150122
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
An electronic device includes a host module and a first expansion module. The first expansion module has a first wall and a second wall substantially parallel to the first wall. A host connector is located on the second wall. The first expansion module includes a first coupling wall and a first expansion wall substantially parallel to the first coupling wall. A first coupler is located on the first coupling wall. The first expansion module can be stacked on the host module where the first coupling wall contacts the second wall. The first coupler is electrically and detachably coupled to the host connector.
Public/Granted literature
- US20160216734A1 ELECTRONIC DEVICE WITH STACKABLE MODULES Public/Granted day:2016-07-28
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