Invention Grant
- Patent Title: Device sandwich structured composite housing
- Patent Title (中): 装置三明治结构复合外壳
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Application No.: US14603142Application Date: 2015-01-22
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Publication No.: US09575523B2Publication Date: 2017-02-21
- Inventor: Kurt A. Jenkins , Edward Burress , Jaya Narain , Robert J. Bergeson , Andrew W. Hill , Taylor Stellman
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Agent Qudus Olaniran; Judy Yee; Micky Minhas
- Main IPC: H01L21/326
- IPC: H01L21/326 ; G06F1/20 ; G06F1/16 ; G06F3/041 ; G06F3/045 ; H01L23/373 ; H01L23/40
Abstract:
The description relates to devices, such as computing devices. One example can include a sandwich structured composite housing. The example can also include a set of electronic components positioned over the sandwich structured composite housing. The set of electronic components can have a profile against the sandwich structured composite housing. The sandwich structured composite housing can have a corresponding negative profile.
Public/Granted literature
- US20160216748A1 DEVICE SANDWICH STRUCTURED COMPOSITE HOUSING Public/Granted day:2016-07-28
Information query
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