Disclosed is a wireless transceiver for a vehicle and a method of manufacturing the same. In a wireless transceiver manufacturing process according to the present disclosure and a method of manufacturing the same, both of the top and bottom sides of a circuit board, on which components are mounted, are encapsulated using a resin material in a state where the circuit board floats in a cavity. A pin configured to support the circuit board is installed and a decoration flat member is fixed to the surface of the circuit board opposite to the side where the pin is installed using double-sided tape. As a result, it is possible to prevent the resin case from being warped by heat generated from the circuit board. In addition, it is possible to omit an existing post-processing process for preventing the damage to the circuit board which may be caused when one side of the circuit board is exposed to the outside as it is. Thus, steps of the manufacturing process and the manufacturing costs can be reduced.