Invention Grant
- Patent Title: Wire harness waterproof structure
- Patent Title (中): 线束防水结构
-
Application No.: US15060940Application Date: 2016-03-04
-
Publication No.: US09576704B2Publication Date: 2017-02-21
- Inventor: Shota Aragiri
- Applicant: Sumitomo Wiring Systems, Ltd
- Applicant Address: JP Yokkaichi, Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie
- Agency: Dinsmore & Shohl LLP
- Priority: JP2015-043283 20150305
- Main IPC: H02G15/08
- IPC: H02G15/08 ; H01B7/282 ; B60R16/02 ; H01B7/00 ; H02G15/18

Abstract:
A wire harness waterproof structure is provided that allows the water sealant to be visually checked, enables reliably filling of the periphery of a splice portion with the water sealant, and enables water in an unfilled region to easily drain. The wire harness waterproof structure includes electrical lines forming an intermediate splice portion, an exterior member surrounding the entire circumference of the intermediate splice portion and adjacent end portions, and a curing layer made up of a water sealant wherein a gap between the intermediate splice portion and the exterior member is filled. The waterproof sheet material is curved so as to surround the splice portion and the adjacent end portions. The sheet material has seeping holes allowing a portion of the curing layer to seep, and enable moisture to be drained to the outer surface in a region not filled with the water sealant.
Public/Granted literature
- US20160260523A1 WIRE HARNESS WATERPROOF STRUCTURE Public/Granted day:2016-09-08
Information query