Invention Grant
- Patent Title: Electronic component and method for manufacturing electronic component
- Patent Title (中): 电子元器件及其制造方法
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Application No.: US14209205Application Date: 2014-03-13
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Publication No.: US09576721B2Publication Date: 2017-02-21
- Inventor: Shinichi Sakamoto , Zhigang Cheng , Fernando Chan Mock , Mitsugu Kawarai
- Applicant: SUMIDA Corporation
- Applicant Address: JP
- Assignee: Sumida Corporation
- Current Assignee: Sumida Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201310109345 20130329; CN201410050474 20140213
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/02 ; H01F41/02 ; H01F41/04 ; H01F27/30

Abstract:
An electronic component includes a magnetic core member, a winding and a magnetic exterior body. The magnetic core member has a flat base and a core. The flat base has a top surface, a bottom surface, a first side surface and a second side surface opposite to the first side surface. The core is located on the top surface of the flat base. A winding has an edgewise coil and two non-wound flat wires that extend from the edgewise coil. A magnetic exterior body covers at least the core and the edgewise coil. The two non-wound flat wires continuously extend along the top surface, the first side surface, the bottom surface and the second side surface of the flat base in this order. The two non-wound flat wires located on the bottom surface work as electrodes.
Public/Granted literature
- US20140266541A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT Public/Granted day:2014-09-18
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