Invention Grant
US09576727B2 Capacitor, capacitor mounting structure, and taped electronic component series
有权
电容器，电容器安装结构和胶带电子元件系列
- Patent Title: Capacitor, capacitor mounting structure, and taped electronic component series
- Patent Title (中): 电容器，电容器安装结构和胶带电子元件系列
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Application No.: US14532118Application Date: 2014-11-04
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Publication No.: US09576727B2Publication Date: 2017-02-21
- Inventor: Tadateru Yamada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2013-229162 20131105; JP2014-057592 20140320
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H01G2/06 ; H01G4/30 ; H01G4/12
Abstract:
In a capacitor main body, a dimension along the thickness direction of a first region where a first inner electrode and a second inner electrode are provided is t1, a dimension along the thickness direction of a second region that is positioned on the side of a first main surface relative to the first region is t2, and a dimension along the thickness direction of a third region that is positioned on the side of a second main surface relative to the first region is t3. A condition of t2/t1> about 0.15 and a condition of t3/t1> about 0.15 are satisfied.
Public/Granted literature
- US20150122537A1 CAPACITOR, CAPACITOR MOUNTING STRUCTURE, AND TAPED ELECTRONIC COMPONENT SERIES Public/Granted day:2015-05-07
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